Sharir, S. (2024). Thermosonic micro-interconnections: Interfacial Cu-Al intermetallics compound growth studies based on stress modelling.
Chicago Style (17th ed.) CitationSharir, Shariza. Thermosonic Micro-interconnections: Interfacial Cu-Al Intermetallics Compound Growth Studies Based on Stress Modelling. 2024.
MLA (9th ed.) CitationSharir, Shariza. Thermosonic Micro-interconnections: Interfacial Cu-Al Intermetallics Compound Growth Studies Based on Stress Modelling. 2024.
Warning: These citations may not always be 100% accurate.
