APA (7th ed.) Citation

Azizan, S. (2024). Delamination study between leadframe substrate and epoxy mold compound for small outline semiconductor packaging.

Chicago Style (17th ed.) Citation

Azizan, Suhaimi. Delamination Study Between Leadframe Substrate and Epoxy Mold Compound for Small Outline Semiconductor Packaging. 2024.

MLA (9th ed.) Citation

Azizan, Suhaimi. Delamination Study Between Leadframe Substrate and Epoxy Mold Compound for Small Outline Semiconductor Packaging. 2024.

Warning: These citations may not always be 100% accurate.