Delamination study between leadframe substrate and epoxy mold compound for small outline semiconductor packaging

Superior quality and reliable semiconductor integrated circuit (IC) packaging is required in electronic products especially for automotive applications due to the user safety concern. Therefore, improvement and controlling of IC package defects to reduce field application and reliability failure is...

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Bibliographic Details
Main Author:	Azizan, Suhaimi
Format:	Thesis
Language:	English English
Published:	2024
Online Access:	http://eprints.utem.edu.my/id/eprint/28596/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=124364
Abstract	Abstract here

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