The new formulation of hybridization GNP/AG highly thermal conductivity

• Auteur principal: Ab Wahid, Ameeruz Kamal
• Format: Thèse
• Langue: anglais; anglais
• Publié: 2023
• Sujets: T Technology (General); TP Chemical technology
• Accès en ligne: http://eprints.utem.edu.my/id/eprint/29263/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=123789

Flexible electronics have become highly desirable for a variety of applications because of their low cost, lightweight characteristics, and flexibility. However, one of the challenges in developing a flexible electronic is depending on a suitable ink material formulation. The graphene nanoplatelets (GNP) sheets are inherently stacked together because of the strong van der Waals interactions between adjacent layers. Silver is the most popular metallic material due to its excellent electrical conductivity and chemical stability. This thesis aimed to investigate the characteristics and applications of graphene and silver conductive ink mixed with an organic solvent, which had low resistivity, high flexibility, and high thermal conductivity. Four strategies were adopted to develop such inks. The first was to formulate a new formulation of conductive ink. The second was to characterise the electrical, mechanical, and thermal behaviour of a new formulation of conductive ink. The third was to simulate the proposed formulation characteristics using the finite element method (FEM). The fourth was to validate the thermal conductivity and resistivity relationship of the new formulation. To evaluate the performance in terms of electrical, mechanical, and thermal conductivity, this research firstly developed a GNP baseline using GNP as the only conductive filler with epoxy. Finite element analysis (FEA) was used to validate the GNP baseline stretchability and thermal conductivity formulations. Following that, research was carried out on the formulation and perfonnance of GNP hybrids using GNP, silver flakes (Ag), and silver acetate (SA) as conductive fillers mixed with organic solvents. After the twisting and bending test, the GNP hybrid formulation reliability was evaluated. The use of GNP and silver conductive ink in combination with an organic solvent result in low resistance, high flexibility, and high thennal conductivity. GNP baseline and GNP hybrid formulations were compared in terms of electrical, mechanical, and thermal conductivity. The finding that the resistivity value of 0.1 wt.% GNP of GNP hybrid is 2.35 x 10-7 O..m, which is significantly lower than the resistivity value of GNP baseline, 0.249 O..m, demonstrates that mixing GNP with silver improves the performance of eiectrical conductivity. The GNP hybrid had the highest shear and thennal conductivity values of 1.98 MPa and 367.28 W/m.K. The GNP hybrid formulation could minimise the amount of silver used in the production of conductive ink. The GNP hybrid also improved conductive ink flexibility and thermal conductivity, which will have an impact on circuit manufacturing in the electronics industry.