Abu Hassan, N. (2009). Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रAbu Hassan, Nurfazlin. Study of Interfacial Reaction During Reflow Soldering of Sn-Ag-Cu Lead-free Solders on Bare Coppper and Immersion Silver Surface Finishes. 2009.
एमएलए (9वां संस्करण) प्रशस्ति पत्रAbu Hassan, Nurfazlin. Study of Interfacial Reaction During Reflow Soldering of Sn-Ag-Cu Lead-free Solders on Bare Coppper and Immersion Silver Surface Finishes. 2009.
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