Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
Due to increasing environmental and health concerns related to the toxicity of traditional tin-lead solders, lead-free solders appear as promising replacement for the eutectic solder alloy in flip chip technology. Then a surface finish is designed to protect the copper surface against oxidation as w...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2009
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| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.utm.my/10063/1/NurfazlinAbuHassanMFKM2009.pdf |