Classical and damage mechanics-based models for lead-free solder interconnects

Solder joint reliability (SJR) is the key concern in electronics packaging, primarily for ball grid array (BGA) packages. It affects the overall performance and reliability of electronics devices. In this project, the response of Sn-4.0Ag-0.5Cu (SAC405) lead-free solder joints in a typical BGA packa...

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Bibliographic Details

Main Author:	Lai, Zheng Bo
Format:	Thesis
Language:	English
Published:	2009
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/11344/1/LaiZhengBoMFKM2009.pdf