The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish
Surface finish is coated layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold ele...
| मुख्य लेखक: | Jaidi, Zolhafizi |
|---|---|
| स्वरूप: | Dissertation |
| भाषा: | अंग्रेज़ी अंग्रेज़ी अंग्रेज़ी |
| प्रकाशित: |
2020
|
| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.uthm.edu.my/1161/ |
| Abstract | Abstract here |
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समान संसाधन
-
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प्रकाशित: (2017) -
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द्वारा: Yeap Kong Boon
प्रकाशित: (2025) -
Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
द्वारा: Hashim, Muhammad Syafiq
प्रकाशित: (2023) -
Interfacial reactions between lead-free solders and engineering surface finishes
द्वारा: Saszlena Rasmi
प्रकाशित: (2025) -
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
प्रकाशित: (2025)