Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish

In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and...

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书目详细资料

主要作者:	Tai, Siew Fong
格式:	Thesis
语言:	英语
出版:	2003
主题:	TJ Mechanical engineering and machinery
在线阅读:	http://eprints.utm.my/4392/1/TaiSiewFongMFKM2003.pdf