Variability reduction in stencil printing of solder paste for surface mount technology
Competition in stencil printing to produce excellence in the finished product is intense. Faults in the printing process are a major source of board failure. Studies have shown that over 63% of defects identified after reDow originated from the solder paste printing ( A. Lotfi ,1998 ) . Howeve...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | Dissertation |
| اللغة: | الإنجليزية |
| منشور في: |
1998
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.uthm.edu.my/7697/ |
| Abstract | Abstract here |