Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. Howe...
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| Format: | Thèse |
| Langue: | anglais anglais anglais |
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2017
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| Accès en ligne: | http://eprints.uthm.edu.my/853/ |
| Abstract | Abstract here |