Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text)
Migration record. Kindly check the attachment for the abstract
| Format: | Thesis |
|---|---|
| Published: |
2025
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| Subjects: | |
| Online Access: | https://utmik.utm.my/handle/123456789/175772 |
| Abstract | Abstract here |
| _version_ | 1854975154238521345 |
|---|---|
| description | Migration record. Kindly check the attachment for the abstract |
| format | Thesis |
| id | utm-123456789-175772 |
| institution | Universiti Teknologi Malaysia |
| publishDate | 2025 |
| record_format | dspace |
| record_pdf | Abstract |
| spelling | utm-123456789-1757722025-08-11T18:25:38Z Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text) Solder and soldering Migration record. Kindly check the attachment for the abstract Fahmi Mokhsen Migration record. Kindly check the attachment for the conferment. 2025-08-11T04:09:19Z 2025-08-11T04:09:19Z 2007-08-24 Thesis https://utmik.utm.my/handle/123456789/175772 vital:9335 42213 application/pdf |
| spellingShingle | Solder and soldering Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text) |
| thesis_level | Other |
| title | Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text) |
| title_full | Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text) |
| title_fullStr | Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text) |
| title_full_unstemmed | Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text) |
| title_short | Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text) |
| title_sort | materials interaction during soldering and isothermal ageing of sn pb and sn ag cu solders on electroless ni au surface finish full text |
| topic | Solder and soldering |
| url | https://utmik.utm.my/handle/123456789/175772 |