Interfacial reactions between lead-free solders and engineering surface finishes
Migration record. Kindly check the attachment for the abstract
| Main Author: | Saszlena Rasmi |
|---|---|
| Other Authors: | Migration record. Kindly check the attachment for the supervisor's name. |
| Format: | Bachelor thesis |
| Language: | English |
| Published: |
Universiti Teknologi Malaysia
2025
|
| Subjects: | |
| Online Access: | https://utmik.utm.my/handle/123456789/176607 |
| Abstract | Abstract here |
Similar Items
Evaluation of different lead free solders
by: Lim Chong Kheng
Published: (2025)
by: Lim Chong Kheng
Published: (2025)
Intermetallic formation during soldering on EPIG and Cu surface finishes
by: Yusreena Yusuf
Published: (2025)
by: Yusreena Yusuf
Published: (2025)
Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish
by: Koh Joyce Swee Fong
Published: (2025)
by: Koh Joyce Swee Fong
Published: (2025)
The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish
by: Moey Chin Boon
Published: (2025)
by: Moey Chin Boon
Published: (2025)
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text)
Published: (2025)
Published: (2025)
Effect of flux type on intermetallics formation in solder joint
by: Cheong Jeng Seng
Published: (2025)
by: Cheong Jeng Seng
Published: (2025)
Mechanism of IMC growth during non-linear solder reflow
by: See Phen Chiak
Published: (2025)
by: See Phen Chiak
Published: (2025)
A unified constitutive model for solder materials (Full text)
Published: (2025)
Published: (2025)
Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint
by: Tan Kok Hoong
Published: (2025)
by: Tan Kok Hoong
Published: (2025)
Classical and damage mechanics-based models for lead-free solder interconnects
by: Lai Zheng Bo
Published: (2025)
by: Lai Zheng Bo
Published: (2025)
Study of interfacial reactions between lead - free solders and immersion silver finish
Published: (2025)
Published: (2025)
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
by: Binh, Duong Ngoc
Published: (2009)
by: Binh, Duong Ngoc
Published: (2009)
Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes
Published: (2025)
Published: (2025)
Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish
by: Yeap Kong Boon
Published: (2025)
by: Yeap Kong Boon
Published: (2025)
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
Published: (2025)
Published: (2025)
Radiation doses effect on micromechanical properties, microstructure evolution and thermal stability of Sn-Ag-Cu solder
by: Nur Farisa Nadia, Mohmad Lehan
Published: (2025)
by: Nur Farisa Nadia, Mohmad Lehan
Published: (2025)
Deformation response of lead-free solder
by: Koh Ching Theng
Published: (2025)
by: Koh Ching Theng
Published: (2025)
Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
by: Bakir, Mohammed Luay
Published: (2012)
by: Bakir, Mohammed Luay
Published: (2012)
Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
by: Wahab, Abdul Karim Abdul
Published: (2011)
by: Wahab, Abdul Karim Abdul
Published: (2011)
Characterization Of Indium Based Low Temperature Solder Alloy And The Effect On Surface Finish
by: Mhd Noor, Ervina Efzan
Published: (2013)
by: Mhd Noor, Ervina Efzan
Published: (2013)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
by: Mayappan, Ramani
Published: (2007)
by: Mayappan, Ramani
Published: (2007)
Intermetallics formed between Sn-Ag-Cu solders and electroless nickel/ electroless palladium/ immersion gold surface finish
by: Lock, Poh Choo
Published: (2025)
by: Lock, Poh Choo
Published: (2025)
Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
by: Siti Faizah Mad Asasaari
Published: (2025)
by: Siti Faizah Mad Asasaari
Published: (2025)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Effect of bismuth doping on intermetallic compound between SN-AG-CU and SN-AG solders on electroless nickel (phosphorus)/ immersion gold surface finish
by: Chong Phey Shan
Published: (2025)
by: Chong Phey Shan
Published: (2025)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
by: Mayappan, Ramani
Published: (2007)
by: Mayappan, Ramani
Published: (2007)
Properties Of Low Temperature Indium-Based Ternary Lead Free Solders System [TS610. S165 2008 f rb].
by: Jahari, Mohamad Salimin
Published: (2008)
by: Jahari, Mohamad Salimin
Published: (2008)
Activation energy study of intermetallic with the addition of graphene nanosheets into Sn-3.5Ag lead-free solder / Amirah Salleh
by: Salleh, Amirah
Published: (2021)
by: Salleh, Amirah
Published: (2021)
Intermetallic and leaching study of (sn-8zn-3bi)-1ag lead-free solder / Nor Aishah Jasli
by: Jasli, Nor Aishah
Published: (2016)
by: Jasli, Nor Aishah
Published: (2016)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)
by: Yahya, Iziana
Published: (2016)
Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
by: Ab Ghani, Noor Asikin
Published: (2016)
by: Ab Ghani, Noor Asikin
Published: (2016)
Fabrication And Characterization Of Lead Free Pewter Alloys
by: Chou, Soklin
Published: (2011)
by: Chou, Soklin
Published: (2011)
Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation
[TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
by: Oo, Cheng Ee
Published: (2004)
by: Oo, Cheng Ee
Published: (2004)
The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
by: Zakaria, Mohamad Fadley
Published: (2008)
by: Zakaria, Mohamad Fadley
Published: (2008)
Interfacial fracture in sandwich laminates
by: Megat Hafizudin Yaacop
Published: (2025)
by: Megat Hafizudin Yaacop
Published: (2025)
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
by: Duong, Ngoc Binh
Published: (2005)
by: Duong, Ngoc Binh
Published: (2005)
Effect of environmental condition and nickel underlayer on whiskers formation in tin surface finish
by: Siti Zahira Yusof
Published: (2025)
by: Siti Zahira Yusof
Published: (2025)
Effect Of Tool Geometry And Nose Profile Micro-Deviation On Surface Roughness In Finish Turning
by: Sung , Aun Naa
Published: (2015)
by: Sung , Aun Naa
Published: (2015)
Development Of Lead-free Tungsten Carbide-based Polymeric Bricks As Gamma Radiation Shielding
by: Abualroos, Nadin J D
Published: (2022)
by: Abualroos, Nadin J D
Published: (2022)
Similar Items
-
Evaluation of different lead free solders
by: Lim Chong Kheng
Published: (2025) -
Intermetallic formation during soldering on EPIG and Cu surface finishes
by: Yusreena Yusuf
Published: (2025) -
Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish
by: Koh Joyce Swee Fong
Published: (2025) -
The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish
by: Moey Chin Boon
Published: (2025) -
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish (Full text)
Published: (2025)