Foo, Z. S., & Ahmad Baharuddin Abd. Rahman, s. (2025). Bond stress of grout-filled splice sleeve integrated with transverse bar under incremental tensile load. Universiti Teknologi Malaysia.
Style de citation Chicago (17e éd.)Foo, Zhi Sien, et supervisor Ahmad Baharuddin Abd. Rahman. Bond Stress of Grout-filled Splice Sleeve Integrated with Transverse Bar Under Incremental Tensile Load. Universiti Teknologi Malaysia, 2025.
Style de citation MLA (9e éd.)Foo, Zhi Sien, et supervisor Ahmad Baharuddin Abd. Rahman. Bond Stress of Grout-filled Splice Sleeve Integrated with Transverse Bar Under Incremental Tensile Load. Universiti Teknologi Malaysia, 2025.
Attention : ces citations peuvent ne pas être correctes à 100%.