Items where Author is "MAYAPPAN, RAMANI A/L"

Article

MAYAPPAN, RAMANI A/L (2007) Intermetallic Study between Sn-Ag-Cu-Zn solders and copper su9bstrate. ISSN 1823-0180

MAYAPPAN, RAMANI A/L (2008) Joint Strength and Interfacial Microstructure between Sn-Pb, Sn-Zn and Sn-Zn-Bi Solders on Cu Substrate. Malaysian Journal of Microscopy, 15 (1). ISSN 0128-8393

MAYAPPAN, RAMANI A/L (2006) Microstructural Evoluation and Growth Kinetics of Sn-40Pb/Cu Solder Joint During Long-term Aging at 125C. Journal of Nuclear and Related Technologies, 4. ISSN 1675-9885

MAYAPPAN, RAMANI A/L (2005) A Study on Microstructure and Wetting Properties of Eutectic Sn-Pb, Sn-Zn and Sn-Zn-Bi Lead Free Solders using Wetting Balance Instrument. Malaysian Journal of Microscopy. ISSN 0128-2635

Conference or Workshop Item

MAYAPPAN, RAMANI A/L (2008) Microstructure Evaluation and Growth Kinetics of Sn-40Pb/Cu Solder Joint during Long-term Aging at 125oC. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2005) A Study on Microstructure and the Influence of Sample Perimeter and Dipping Rate on Wetting Properties on Sn-Pb and Sn-Zn based Lead Free Solders. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2004) A Study on Microstructure and Wetting Properties of Eutectic Sn-Pb, Sn-Zn and Sn-Zn-Bi Lead Free Solders using Wetting Balance Instrument. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2005) Joint Strength and Interfacial Microstructure between Sn-Pb, Sn-Zn and Sn-Zn-Bi Solders on Cu Substrate. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2004) A Study on Microstructure and Wetting Properties of Eutectic Sn-Pb, Sn-Zn and Sn-Zn-Bi Lead Free Solders. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2006) Contact Angle and Intermetallic Thickness Measurement of Sn-Zn based Lead Free Solders on Copper Substrates. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2004) Correlation Study between Wetting Properties and Surface Roughness and the Influence of Fluxes on Sn-Pb, Sn-Zn and Sn-Zn-Bi Lead Free Solders. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2010) Cu-Zn5 and Cu5Zn8 Intermetallic Study in the Sn-8Zn-3Bi Solder Joint During Liquid State Aging. In: UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2009) Evoluation of Interfacial Morphology and Growth Kinetics of Sn-Zn-Bi/Cu System during Isothermal Aging. In: UNSPECIFIED.

Book

MAYAPPAN, RAMANI A/L (2010) Interaction of Sn-9Zn and Sn-8Zn-3Bi lead-free on copper metallization. UNSPECIFIED.

MAYAPPAN, RAMANI A/L (2011) Intermetallic Study between Sn-Ag-Cu-Zn solders and copper su9bstrate. UNSPECIFIED.