Items where Author is "NADZRI, ALLINA BINTI"
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Article
NADZRI, ALLINA BINTI (2010) Study of Lead Free Solder Joint Material used in Semiconductor Packaging Subjected to Thermal Condition. ISSN 1675-1302
Conference or Workshop Item
NADZRI, ALLINA BINTI (2009) Study of Lead Free Solder Joint Material used in Semiconductor Packaging Subjected to Thermal Condition. In: UNSPECIFIED.