Joint Strength and Interfacial Microstructure between Sn-Pb, Sn-Zn and Sn-Zn-Bi Solders on Cu Substrate

MAYAPPAN, RAMANI A/L (2005) Joint Strength and Interfacial Microstructure between Sn-Pb, Sn-Zn and Sn-Zn-Bi Solders on Cu Substrate. In: UNSPECIFIED.

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Item Type:	Conference or Workshop Item (UNSPECIFIED)
PRISMA ID:	8930
URI:	http://oarr.uitm.edu.my/id/eprint/19997

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