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A Study on Microstructure and the Influence of Sample Perimeter and Dipping Rate on Wetting Properties on Sn-Pb and Sn-Zn based Lead Free Solders

MAYAPPAN, RAMANI A/L (2005) A Study on Microstructure and the Influence of Sample Perimeter and Dipping Rate on Wetting Properties on Sn-Pb and Sn-Zn based Lead Free Solders. In: UNSPECIFIED.

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Item Type: Conference or Workshop Item (UNSPECIFIED)
PRISMA ID: 8942
URI: http://oarr.uitm.edu.my/id/eprint/20000

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