MAYAPPAN, RAMANI A/L (2008) Microstructure Evaluation and Growth Kinetics of Sn-40Pb/Cu Solder Joint during Long-term Aging at 125oC. In: UNSPECIFIED.
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| Item Type: | Conference or Workshop Item (UNSPECIFIED) |
|---|---|
| PRISMA ID: | 8944 |
| URI: | http://oarr.uitm.edu.my/id/eprint/20001 |
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