Cu-Zn5 and Cu5Zn8 Intermetallic Study in the Sn-8Zn-3Bi Solder Joint During Liquid State Aging

MAYAPPAN, RAMANI A/L (2010) Cu-Zn5 and Cu5Zn8 Intermetallic Study in the Sn-8Zn-3Bi Solder Joint During Liquid State Aging. In: UNSPECIFIED.

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Item Type:	Conference or Workshop Item (UNSPECIFIED)
PRISMA ID:	28676
URI:	http://oarr.uitm.edu.my/id/eprint/27224

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