A Study on Microstructure and Wetting Properties of Eutectic Sn-Pb, Sn-Zn and Sn-Zn-Bi Lead Free Solders using Wetting Balance Instrument

MAYAPPAN, RAMANI A/L (2005) A Study on Microstructure and Wetting Properties of Eutectic Sn-Pb, Sn-Zn and Sn-Zn-Bi Lead Free Solders using Wetting Balance Instrument. Malaysian Journal of Microscopy. ISSN 0128-2635

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Item Type:	Article
Journal or Publication Title:	Malaysian Journal of Microscopy
PRISMA ID:	500
URI:	http://oarr.uitm.edu.my/id/eprint/4784

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