Joint Strength and Interfacial Microstructure between Sn-Pb, Sn-Zn and Sn-Zn-Bi Solders on Cu Substrate

MAYAPPAN, RAMANI A/L (2008) Joint Strength and Interfacial Microstructure between Sn-Pb, Sn-Zn and Sn-Zn-Bi Solders on Cu Substrate. Malaysian Journal of Microscopy, 15 (1). ISSN 0128-8393

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Item Type:	Article
Journal or Publication Title:	Malaysian Journal of Microscopy
PRISMA ID:	7477
URI:	http://oarr.uitm.edu.my/id/eprint/4786

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