Microstructural Evoluation and Growth Kinetics of Sn-40Pb/Cu Solder Joint During Long-term Aging at 125C

MAYAPPAN, RAMANI A/L (2006) Microstructural Evoluation and Growth Kinetics of Sn-40Pb/Cu Solder Joint During Long-term Aging at 125C. Journal of Nuclear and Related Technologies, 4. ISSN 1675-9885

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Item Type:	Article
Journal or Publication Title:	Journal of Nuclear and Related Technologies
PRISMA ID:	3173
URI:	http://oarr.uitm.edu.my/id/eprint/4787

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