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Latch-up Characteristics of 0.5 micron CMOS Technology on Thick Bonded SOI Substrate

ABDULLAH, WAN FAZLIDA HANIM BT (2009) Latch-up Characteristics of 0.5 micron CMOS Technology on Thick Bonded SOI Substrate. ISSN 1755-2060

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Item Type: Article
PRISMA ID: 27494
URI: http://oarr.uitm.edu.my/id/eprint/6245

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