Latch-up Characteristics of 0.5 micron CMOS Technology on Thick Bonded SOI Substrate

ABDULLAH, WAN FAZLIDA HANIM BT (2009) Latch-up Characteristics of 0.5 micron CMOS Technology on Thick Bonded SOI Substrate. ISSN 1755-2060

Full text not available from this repository.

Metadata

Item Type:	Article
PRISMA ID:	27494
URI:	http://oarr.uitm.edu.my/id/eprint/6245

Actions (login required)

View Item

Citation