Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique
Surface mount technology (SMT) is a method for producing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). It has been emerged in the 1960s,gained momentum in the early 1980s and became widely used by the mid-1990s and is continually...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية الإنجليزية |
| منشور في: |
2016
|
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/20512/1/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdf http://eprints.utem.edu.my/id/eprint/20512/2/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdf |
الانترنت
http://eprints.utem.edu.my/id/eprint/20512/1/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdfhttp://eprints.utem.edu.my/id/eprint/20512/2/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdf