Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique

Surface mount technology (SMT) is a method for producing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). It has been emerged in the 1960s,gained momentum in the early 1980s and became widely used by the mid-1990s and is continually...

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Bibliographic Details

Main Author:	Lim, Kean Teik
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/20512/1/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdf http://eprints.utem.edu.my/id/eprint/20512/2/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdf