Bondability and reliability study on various silver plated copper leadframe with 25um wire diameter of gold and copper wire

Silver spot plated copper leadframe play very importance role in semiconductor industry.Throughout the semiconductor industry intense economic competition has stimulated interest in the area of package cost reduction per year function over the range of products it offers.In an attempt to meet the de...

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Détails bibliographiques
Auteur principal:	Ng, Shay Lee
Format:	Thèse
Langue:	anglais anglais
Publié:	2016
Sujets:	T Technology (General) TS Manufactures
Accès en ligne:	http://eprints.utem.edu.my/id/eprint/20566/1/Bondability%20and%20reliability%20study%20on%20various%20silver%20plated%20copper%20leadframe%20with%2025um%20wire%20diameter%20of%20gold%20and%20copper%20wire.pdf http://eprints.utem.edu.my/id/eprint/20566/2/Bondability%20and%20reliability%20study%20on%20various%20silver%20plated%20copper%20leadframe%20with%2025um%20wire%20diameter%20of%20gold%20and%20copper%20wire.pdf

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