Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress

Quality requirement in the semiconductor industry is getting more stringent due to the application of semiconductor components that are widely used in automotive. Furthermore different materials combination is being introduced to semiconductor packages to improve their package performance and reduce...

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Bibliographic Details

Main Author:	Lee, Cher Chia
Format:	Thesis
Language:	English English
Published:	UTeM 2017
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/23786/1/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress%20-%20Lee%20Cher%20Chia%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23786/2/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress.pdf