APA (7th ed.) Citation

Lee, C. C. (2017). Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM.

Chicago Style (17th ed.) Citation

Lee, Cher Chia. Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM, 2017.

MLA (9th ed.) Citation

Lee, Cher Chia. Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM, 2017.

Warning: These citations may not always be 100% accurate.