Lee, C. C. (2017). Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM.
Chicagoスタイル(17版)引用形式Lee, Cher Chia. Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM, 2017.
MLA(9版)引用形式Lee, Cher Chia. Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM, 2017.
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