Lee, C. C. (2017). Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM.
芝加哥风格引文Lee, Cher Chia. Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM, 2017.
MLA引文Lee, Cher Chia. Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress. UTeM, 2017.
警告：这些引文格式不一定是100％准确.