Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress

Quality requirement in the semiconductor industry is getting more stringent due to the application of semiconductor components that are widely used in automotive. Furthermore different materials combination is being introduced to semiconductor packages to improve their package performance and reduce...

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書誌詳細

第一著者:	Lee, Cher Chia
フォーマット:	学位論文
言語:	英語 英語
出版事項:	UTeM 2017
主題:	T Technology (General) TS Manufactures
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/23786/1/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress%20-%20Lee%20Cher%20Chia%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23786/2/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress.pdf