Process Parameter Optimization Of Adhesive Dispense Machine

Adhesive dispense applications that discussed in this study relate to the process parameter optimization of adhesive dispense machine for Surface Mount Technology (SMT) Applications. SMT Adhesive dispensing process is the process of transferring adhesive onto the PCB solder mask in a position suitab...

詳細記述

書誌詳細

第一著者:	Teo, Boon Guan
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2018
主題:	T Technology (General) TJ Mechanical engineering and machinery
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/23962/1/Process%20Parameter%20Optimization%20Of%20Adhesive%20Dispense%20Machine.pdf http://eprints.utem.edu.my/id/eprint/23962/2/Process%20Parameter%20Optimization%20Of%20Adhesive%20Dispense%20Machine.pdf