Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using

Transfer moulding is a process that generally used at an assembly area in the electronics industry, specifically in the semiconductor plastic packaging industry. This is because the transfer moulding uses an Epoxy Moulding Compound (EMC) material to encapsulate the chip and wire bond that attached t...

书目详细资料
主要作者:	Zainul Hashimi, Faridah
格式:	Thesis
语言:	英语英语
出版:	2019
主题:	T Technology (General) TP Chemical technology
在线阅读:	http://eprints.utem.edu.my/id/eprint/24952/1/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/2/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf

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