The Study Of Temperature Analysis On Fusible Metal Bonding Application
High frequency packages become very important due to the rapid growth of wireless communication system. They require compactness, low cost and high performances ever at frequency up to 60 GHz. Flip-chip device assembly using organic substrates at very high frequency has become a cost competitive pac...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी अंग्रेज़ी |
| प्रकाशित: |
2020
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| विषय: | |
| ऑनलाइन पहुंच: | http://eprints.utem.edu.my/id/eprint/25496/1/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf http://eprints.utem.edu.my/id/eprint/25496/2/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf |