The Study Of Temperature Analysis On Fusible Metal Bonding Application

High frequency packages become very important due to the rapid growth of wireless communication system. They require compactness, low cost and high performances ever at frequency up to 60 GHz. Flip-chip device assembly using organic substrates at very high frequency has become a cost competitive pac...

書誌詳細
第一著者:	Gnanasegaran, Yogeswaran
フォーマット:	学位論文
言語:	英語英語
出版事項:	2020
主題:	T Technology (General) TS Manufactures
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/25496/1/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf http://eprints.utem.edu.my/id/eprint/25496/2/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf

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