Interfacial adhesion between silver ink and thermoplastic polyurethane and electromechanical reliability of flexible printed circuit

Flexible printed circuit (FPC) is one of the promising components in the electronic industries. The advantages of FPC are that its fabrication process is environmentally friendly, low cost, and efficient, which makes it a favourable choice for applications in industrial and medical. The conductive i...

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主要作者:	Mohd Yunos, Afiqah
格式:	Thesis
語言:	英语 英语
出版:	2021
主題:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
在線閱讀:	http://eprints.utem.edu.my/id/eprint/25974/1/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/25974/2/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf