Interfacial adhesion between silver ink and thermoplastic polyurethane and electromechanical reliability of flexible printed circuit

Flexible printed circuit (FPC) is one of the promising components in the electronic industries. The advantages of FPC are that its fabrication process is environmentally friendly, low cost, and efficient, which makes it a favourable choice for applications in industrial and medical. The conductive i...

詳細記述

書誌詳細

第一著者:	Mohd Yunos, Afiqah
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2021
主題:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/25974/1/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/25974/2/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf