Interfacial adhesion between silver ink and thermoplastic polyurethane and electromechanical reliability of flexible printed circuit
Flexible printed circuit (FPC) is one of the promising components in the electronic industries. The advantages of FPC are that its fabrication process is environmentally friendly, low cost, and efficient, which makes it a favourable choice for applications in industrial and medical. The conductive i...
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| Format: | Thèse |
| Langue: | anglais anglais |
| Publié: |
2021
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| Sujets: | |
| Accès en ligne: | http://eprints.utem.edu.my/id/eprint/25974/1/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/25974/2/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf |
Internet
http://eprints.utem.edu.my/id/eprint/25974/1/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdfhttp://eprints.utem.edu.my/id/eprint/25974/2/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf