Surfaces (Technology) Surface preparation Coating processes Tungsten carbide-cobalt alloys

Within electronics industry, flexible printed circuits (FPC) are compiled in stacks to achieve smaller sizes and higher component density. The architecture size of a computer processor has been shrunk from 10 µm to 7 nm from year 1971 to 2020. In order to meet the market expectation, manufacturers h...

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Détails bibliographiques
Auteur principal:	Wong, Kah Yan
Format:	Thèse
Langue:	anglais anglais
Publié:	2021
Sujets:	T Technology (General) TS Manufactures
Accès en ligne:	http://eprints.utem.edu.my/id/eprint/26053/1/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/26053/2/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf

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