Surfaces (Technology) Surface preparation Coating processes Tungsten carbide-cobalt alloys
Within electronics industry, flexible printed circuits (FPC) are compiled in stacks to achieve smaller sizes and higher component density. The architecture size of a computer processor has been shrunk from 10 µm to 7 nm from year 1971 to 2020. In order to meet the market expectation, manufacturers h...
| Auteur principal: | |
|---|---|
| Format: | Thèse |
| Langue: | anglais anglais |
| Publié: |
2021
|
| Sujets: | |
| Accès en ligne: | http://eprints.utem.edu.my/id/eprint/26053/1/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/26053/2/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf |
Internet
http://eprints.utem.edu.my/id/eprint/26053/1/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdfhttp://eprints.utem.edu.my/id/eprint/26053/2/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf