Plasma etching process for aluminum-copper metallization by photoresist margin improvement for CMOS 0.13-µm technology

In wafer fabrication manufacturing, the aluminum etching process is a dry plasma etching process used as the main process for construction of aluminum copper (AlCu) interconnect structures. As customer requirements changed for faster, more reliable and lower cost chips, chip manufacturers have learn...

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書誌詳細

第一著者:	Mohamed Hassan, Wan Faizal
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2022
主題:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/26870/1/Plasma%20etching%20process%20for%20aluminum-copper%20metallization%20by%20photoresist%20margin%20improvement%20for%20CMOS%200.13-%C2%B5m%20technology.pdf http://eprints.utem.edu.my/id/eprint/26870/2/Plasma%20etching%20process%20for%20aluminum-copper%20metallization%20by%20photoresist%20margin%20improvement%20for%20CMOS%200.13-%C2%B5m%20technology.pdf