The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging

Recently, the attention toward CNT-composite solder (CCS) has increased remarkably due to numerous advantages. However, the electronic devices’ failure is still growing and has become an integral part of the countless product in the industrial market. These failures are mainly related to the reliabi...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي: Ahmad, Intan Fatihah
التنسيق: أطروحة
اللغة:الإنجليزية
الإنجليزية
منشور في: 2022
الموضوعات:
T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
الوصول للمادة أونلاين:http://eprints.utem.edu.my/id/eprint/26873/1/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf
http://eprints.utem.edu.my/id/eprint/26873/2/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf

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