Integrated feed forward system for chemical mechanical polishing oxide removal process automation to improve productivity

Chemical Mechanical Planarization (CMP) is one of the main processes in semiconductor wafer fabrication. It is the only process that has contact physically with the wafer, where a pad is placed directly onto the wafer and polished in a circular motion at a particular speed to planarize the wafer sur...

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书目详细资料

主要作者:	Ramlan, Samad
格式:	Thesis
语言:	英语 英语
出版:	2022
主题:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
在线阅读:	http://eprints.utem.edu.my/id/eprint/26945/1/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf http://eprints.utem.edu.my/id/eprint/26945/2/Integrated%20feed%20forward%20system%20for%20chemical%20mechanical%20polishing%20oxide%20removal%20process%20automation%20to%20improve%20productivity.pdf