Microstructural characterization of pressureless sintered silver die attached material
Sintered silver (Ag) is one of the most promising interconnect materials for high power electronics applications due to its ability to withstand high temperature exceeding 250 °C while in operation.In this thesis, themicrostructural evolutions of spherical and flake types pressureless sintered Ag di...
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| Format: | Thèse |
| Langue: | anglais anglais |
| Publié: |
2022
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| Accès en ligne: | http://eprints.utem.edu.my/id/eprint/26950/1/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf http://eprints.utem.edu.my/id/eprint/26950/2/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf |
Internet
http://eprints.utem.edu.my/id/eprint/26950/1/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdfhttp://eprints.utem.edu.my/id/eprint/26950/2/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf