Thermosonic micro-interconnections: Interfacial Cu-Al intermetallics compound growth studies based on stress modelling

One of the most common wire bonding technology involving copper (Cu) wire interconnections is the thermosonic bonding technique. Still, the volumetric changes of intermetallic compounds (IMCs) formed at the bonding interface of Cu wire on Al bond pads induce voids formation in the Cu-Al IMC layer. T...

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書誌詳細

第一著者:	Sharir, Shariza
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2024
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/28287/1/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf http://eprints.utem.edu.my/id/eprint/28287/2/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf