A development of Time Domain Reflectometry (TDR) methodology to detect wire sweep defect in nearly short condition

Wire sweep is a common defect observed in power semiconductor devices, especially when bonded with thin aluminium wire (< 100μm). The conventional methods for detecting the wire sweep defect are Automatic Optical Inspection (AOI), Real-Time X-ray and Automatic Test Equipment (ATE). However, all t...

पूर्ण विवरण

ग्रंथसूची विवरण
मुख्य लेखक: Ng, Kiong Kay
स्वरूप: थीसिस
भाषा:अंग्रेज़ी
अंग्रेज़ी
प्रकाशित: 2023
विषय:
T Technology (General)
TA Engineering (General). Civil engineering (General)
ऑनलाइन पहुंच:http://eprints.utem.edu.my/id/eprint/28301/1/A%20development%20of%20Time%20Domain%20Reflectometry%20%28TDR%29%20methodology%20to%20detect%20wire%20sweep%20defect%20in%20nearly%20short%20condition.pdf
http://eprints.utem.edu.my/id/eprint/28301/2/A%20development%20of%20Time%20Domain%20Reflectometry%20%28TDR%29%20methodology%20to%20detect%20wire%20sweep%20defect%20in%20nearly%20short%20condition.pdf

इंटरनेट

http://eprints.utem.edu.my/id/eprint/28301/1/A%20development%20of%20Time%20Domain%20Reflectometry%20%28TDR%29%20methodology%20to%20detect%20wire%20sweep%20defect%20in%20nearly%20short%20condition.pdf
http://eprints.utem.edu.my/id/eprint/28301/2/A%20development%20of%20Time%20Domain%20Reflectometry%20%28TDR%29%20methodology%20to%20detect%20wire%20sweep%20defect%20in%20nearly%20short%20condition.pdf

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