A development of Time Domain Reflectometry (TDR) methodology to detect wire sweep defect in nearly short condition

Wire sweep is a common defect observed in power semiconductor devices, especially when bonded with thin aluminium wire (< 100μm). The conventional methods for detecting the wire sweep defect are Automatic Optical Inspection (AOI), Real-Time X-ray and Automatic Test Equipment (ATE). However, all t...

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Bibliographic Details

Main Author:	Ng, Kiong Kay
Format:	Thesis
Language:	English English
Published:	2023
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General)
Online Access:	http://eprints.utem.edu.my/id/eprint/28301/1/A%20development%20of%20Time%20Domain%20Reflectometry%20%28TDR%29%20methodology%20to%20detect%20wire%20sweep%20defect%20in%20nearly%20short%20condition.pdf http://eprints.utem.edu.my/id/eprint/28301/2/A%20development%20of%20Time%20Domain%20Reflectometry%20%28TDR%29%20methodology%20to%20detect%20wire%20sweep%20defect%20in%20nearly%20short%20condition.pdf