Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
The need for replacing lead based solder has received great attention among researchers because of their toxicity. The Sn-Ag-Cu family is the most promising candidate. However, these solder systems need better improvement in terms of controlling their intermetallic formation, growth rate and also th...
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2016
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| 主題: | |
| オンライン･アクセス: | https://ir.uitm.edu.my/id/eprint/17882/1/17882.pdf |