Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish

Interconnection material examination of composite solder materials and general comparison of the joints with the solder alloy are fundamental to search for more comparable and dependable alternative to the solder candidate. In this investigation, SAC105 carries two reinforced parameters, carbo...

詳細記述

書誌詳細
第一著者: Krishna, Vidyatharran
フォーマット: 学位論文
言語:英語
出版事項: 2020
主題:
オンライン・アクセス:http://psasir.upm.edu.my/id/eprint/97861/1/FK%202021%2040%20UPMIR.pdf