Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...

書目詳細資料
主要作者:	Siah, Meng Zhe
格式:	Thesis
出版:	2019
主題:	TJ Mechanical engineering and machinery

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